Novel tin ‘bubbles’ spur advances in the development of integrated chips

The use of extreme ultraviolet light sources in making advanced integrated chips has been considered, but their development has been hindered owing to a paucity of efficient laser targets. Scientists at Tokyo Institute of Technology (Tokyo Tech) recently developed an extremely low-density tin ‘bubble,’ which makes the generation of extreme ultraviolet reliable and low cost. This novel technology paves the way for various applications in electronics and shows potential in biotechnology and cancer therapy.